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光电信息大讲堂第六十六讲:一条注定被打破的定律(The law made to be broken)——半导体行业的历史和未来的挑战,和扇出封装(fanout)的解决方案

更新时间:2017-06-07 作者: 该文章已被浏览23次

时    间:  2017 年 6 月 14 日 15 : 00 - 17 : 00
地    点:  南五楼 613 学术报告厅 报告人:  胡川博士,国家千人计划入选者,英特尔公司基础材料研究所 邀请人:  邹雪城     教授
报告摘要:
      The significance of Moore's law is beyond Intel's business success and technology triumph. It has very deep impact on humanity. With the end coming, we would like to understand what have been keeping it going for over five decades and what are technical barriers that will eventually break it down. The general technical part starts with a brief review of historical events in electrical computing and moves onto to existing technical barriers.  He will give both business and technical interpretations of how the semiconductor industry overcame the technical barriers historically and how they are approaching the new barriers. The technical content covers from photo lithography on Si wafers to packaging processes, with a touch on challenges in fundamental physics, material science, electrical, chemical and mechanical engineering. The second half starts with the discussion of a new hotspot in the semiconductor industry that has already attracted tons of investment from Intel, TSMC, Samsung, Apple and more:the fanout package. As one of the original investors of this technology, Dr Hu will discuss about how to apply Fanout package to fabricate devices for the applications in 5G,IOT (smart home, city, automobile, wearables),AI (Artificial Intelligence),high performance computing,etc.

报告人介绍:
    Dr. Chuan Hu received his BS in physics from Beijing University in year 1992 and PhD from Univ. of Texas in year 2000. He worked on high density packaging, heterogeneous integration and wearables in the components research group at Intel Corporation for 14 years from year 2001 to 2014. He is one of the national thousand talent members of China. He has co-authored 30+ technical papers in the fields of heat transfer, electronic packaging, backend reliability, nano material and EUV lithographyand has over 80 issued or pending patents in USA, Japan, Taiwan, China and etc, including patents filed for Intel and for his startup companies in China. His research work at Intel was broadly reported by news media in English, Japanese, Chinese and German.  His PhD. research work was primarily funded by SRC and he later became an industrial liaison of the organization and many other research consortiums such as IFC, NSF, Sematech, etc, which gave him a unique insight on industrial research.  On average, he used to review over 100 white papers each yearand he mentored and ranked students/projects from major universities in USA and beyond. When he worked at Intel, he collaborated with hundreds of suppliers worldwide to develop technologies to elongate the life time of Moore's law.  In 2014, with the end of Moore's law coming, he left Intel to start his own business in China assuming responsibilities in all aspects of running a business. The first startup company is to fabricate sensors using panel level processes. After he accumulated enough IP, he recruited some of his former colleagues and started an IC packaging company to fabricate devices for heavy computing such as in AI and VR application and IOT (internet of things) devices with sensor, communication and energy harvesting functions integrated for general and specific applications.
 
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